제품소개

Product

  • Package & Test process
  • Nozzle
  • Wafer process

Die attach tool

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Die Bonding Tools
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TSV, HBM
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Flipchip Tools
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Ejecting System
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Wire bonding tools

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Capillary
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Wire bonder tools
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Heater block & Clamp
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Vacuum chuck table

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Porous chuck table
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Rubber Chuck Table
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