TSV, HBM
Ceramic bond tools are manufactured suitable for various processes and device sizes. It can be customized in size and vacuum line design to meet customer requirements.
Bonding process
- HBM / Ceramic Bond Tool
- Ceramic Bond Stage
HBM / Ceramic Bond Tool
We provide key components for manufacturing HBM memory, which is used in the latest AI technology.
Leading the future of the semiconductor industry through innovative technology, providing customers with the best quality and performance
We have established ourselves as a trusted partner in the global semiconductor equipment market.
| Material | Hardness | Thermal Conductivity | Electrical Resistivity |
|---|---|---|---|
| AlN-N | 1000 Hv | 200 W/mk | 10¹¹↑(Ω·㎝) |
| AlN-H | 1000 Hv | 230 W/mk | 10¹¹↑(Ω·㎝) |
| SiC | 2000 Hv | 150 W/mk | 106~10↑(Ω·㎝) |
Ceramic bond tools are manufactured suitable for various processes and device sizes.
It can be customized in size and vacuum line design to meet customer requirements.
Ceramic Bond Stage
Ceramic bond stage is used to ensure ‘Flatness’ during die bonding.
We provide customization to fit the design of customer equipment and devices.
