페코텍 PECO

Package & Test process

Ejecting System

Application

Die Bonding Process

The ejector pin lifts the die attached to the mounting tape. It offers three types of products (Normal / Flat / Bottleneck) depending on the purpose.

The products are provided in standard and custom sizes made of tool steel and tungsten carbide.

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Fixed pin block and Pin block holder

To minimize height gap between pins and to reduce issues such as die cracking, they are provided assembled as an integrated type of block.

Customization is offered for pin arrangement and height according to customer requirements.

Ejector cap, Pepper pot

The ejector cap holds the wafer tape through vacuum during die pickup.

We provide products suitable for die bonding by arranging vacuum holes and lines to match the arrangement of the pins.

Customized products can also be offered to fit the customer's equipment.

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