製品

製品

  • Inspection
  • Package & Test process
  • Package & Test process
  • Inspection
  • Inspection
  • Package & Test process
  • Inspection
  • Package & Test process
  • Nozzle
  • Nozzle
  • Nozzle
  • Nozzle
  • Wafer process
  • Wafer process
  • Wafer process
  • Wafer process

Die attach tool

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Die Bonding Tools
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TSV, HBM
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Flipchip Tools
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Ejecting System

Die attach tool

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ダイボンディングツール
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TSV, HBM
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フリップチップツール
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イジェクトシステム

Metal Nozzle

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Solder Ball Jetting Nozzle
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Metal Dispensing Nozzle
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SMT / Mounter Nozzle

Die attach tool

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Die Bonding Tools
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TSV, HBM
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Flipchip Tools
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Ejecting System

Metal Nozzle

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Solder Ball Jetting Nozzle
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Metal Dispensing Nozzle
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SMT / Mounter Nozzle

Die attach tool

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Die Bonding Tools
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TSV, HBM
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Flipchip Tools
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Ejecting System

Metal Nozzle

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Solder Ball Jetting Nozzle
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Metal Dispensing Nozzle
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SMT / Mounter Nozzle

Metal Nozzle

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Solder Ball Jetting Nozzle
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Metal Dispensing Nozzle
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SMT / Mounter Nozzle

Ceramic Nozzle

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キャピラリー
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Solder Ball Pickup Nozzle
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Ceramic Ferrules

Wire bonding tools

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キャピラリー
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ワイヤーボンダーツール
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ヒーターブロック&クランプ

Wire bonding tools

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Capillary
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Wire bonder tools
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Heater block & Clamp

Ceramic Nozzle

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Capillary
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Solder Ball Pickup Nozzle
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Ceramic Ferrules

Wire bonding tools

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Capillary
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Wire bonder tools
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Heater block & Clamp

Ceramic Nozzle

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Capillary
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Solder Ball Pickup Nozzle
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Ceramic Ferrules

Ceramic Nozzle

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Capillary
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Solder Ball Pickup Nozzle
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Ceramic Ferrules

Wire bonding tools

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Capillary
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Wire bonder tools
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Heater block & Clamp

Vacuum chuck table

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Porous chuck table
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Rubber Chuck Table

Vacuum chuck table

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Porous chuck table
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Rubber Chuck Table

Vacuum chuck table

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ポーラスチャックテーブル
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ラバーチャックテーブル

Vacuum chuck table

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Porous chuck table
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Rubber Chuck Table