Rubber Collet
PROCESS FOR RUBBER COLLET
At PECO, we seek to satisfy every customer need from quality and specialization to design with our world-class manufacturing. From raw materials to final production, we control every part of the process for a product that is truly customized and state-of-the-art
Rubber collets are used to transfer the die from the wafer mounting tape to a substrate without damage or stress to the chip during the die bonding process. Our rubber tips feature a wide variety of designs and sizes to fit our customers’ individual needs. Available in Rectangular, Round, Flat, and Customized, our robber collets are both economical, reliable, and of the highest quality.
MATERIALS FOR RUBBER COLLET
We offer a wide variety of raw materials to meet customer requirements; From thermal resistance to mechanical strength and abrasion durability, our diverse array of materials provide a multitude of solutions.
| GRADE | HEAT RESISTANCE | HARDNESS (Shore A) | ELECTRICAL PROPERTIES | RECOMMENDED CONDITIONS |
|---|---|---|---|---|
| PS-Series | ~250℃ | 40~90 | Insulative (1.0E+11≤) |
Continuous Working Temperature: 200~250℃ Thin die with low bonding free Flat type rubber compatible |
| PS-Series | Continuous Working Temperature: 200~250℃ Normal die with medium bonding force |
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| PS-Series | ~200℃ | Continuous Working Temperature: 150~200℃ Widely used in film based die attach |
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| PS-Series | ~150℃ | Continuous Working Temperature: 100~150℃ Standard Type Better thermal resistance than PU-Seires |
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| PS-Series | ~Room Temperature | Continuous Working Temperature: ~100℃ Better wear resistance than PN-Seires |
MATERIALS ANALYSIS
