Ceramic Collet
Fine pitch flip chip (FPFC) packaging (i.e., less than 80um pitch) is an emerging technology in the area of copper-pillar micro-bump 2.5D and 3D joining. It is an adoption of thermo-compression (TC) bonding for flip-chip flux/micro-bump soldering.
In lieu of reflow, TC bonding is now being adopted by companies worldwide. This Ceramic pick-up tool is specially designed for chip bonding at high temperature(>400℃) with pressure.
TCB COLLET & STAGE FEATURES
TCB Collets and Stages are distributed to top global IDM factories & OSAT companies. Our comprehensive service ensures customer satisfaction and encompasses both cleaning and stage milling.
| Product Type | Material Outer | Diameter(mm) |
|---|---|---|
| Normal | HISS (High Speed Steel) TC (Tungsten Carbide) |
0.7 / 0.68 / 0.5 / 0.4 |
| Flat | ||
| Bottle neck |
3D
Drawing
가공 Capa
| Product Type | Method | Min.Hole (mm) |
Min.Vacuum line(mm) |
X-Y-T Tolerance |
Flatness(um) | Ra.(um) | Lead Time * |
|---|---|---|---|---|---|---|---|
| Capability | Laser | 0.05 | 0.1 | ± 10um ↓ | 2↓ | Ra. 0.1 ↓ | 2 wks |
| Tool | 0.3 | 0.3 |
Material property
| SPECIFICITY | DIVSION | PT-AIN | PT-SIC |
|---|---|---|---|
| Thermal Properties |
Thermal conductivity (W/m-k) | >200 | >140 |
| Coefficient of Thermal Expansion (10–6/ ℃ (RT ~ 400 ℃) | 4.5 | 3.7 ~ 4.4 | |
| Specific Heat (KJ / kg · K) | 0.67 | 0.78 | |
| Resistance to thermal Shock (℃) | 350 | 400 | |
| Mechanical Properties |
Specific Gravity | 3.26 | 3.16 |
| Hardness(Hv) | 1200 | 2200 | |
| Bending Strength(Gpa) | 0.3 | 0.48 | |
| Compression Strength(Gpa) | 2.3 | 3.5 | |
| Electrical Properties |
Youngs Modulus(Gpa) | 270 / 20 ℃ 260 / 500 ℃ |
440 |
| Volume Resistivity (Ω · m) | 1011 | 106 | |
| Dielectric Constant | 8.5 / 1MHz 8.5 / 10GHz |
10.2 / 1MHz | |
| Dielectric Loss Tangent(x 10−³) | 1.0 / 1MHz 4.0 / 10GHz |
